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1 Ergebnisse
1
Identification of Common Mode Noise Current Path in a SiC P..:
, In:
2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia)
,
Tzeng, Chih-Ming
;
Chiu, Pin-Tzu
;
Pong, M.H.
... - p. 255-259 , 2023
Link:
https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.1..
RT T1 <cTitle>2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia)</cTitle>: T1 <Title>Identification of Common Mode Noise Current Path in a SiC Power Module</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10213981&Exemplar=1&LAN=DE A1 Tzeng, Chih-Ming A1 Chiu, Pin-Tzu A1 Pong, M.H. A1 Liu, Yan-Cheng A1 Yao, Chun-Jen A1 Lin, Hsin-Han A1 Cheng, Yu-Hua A1 Chiu, Huang-Jen YR 2023 SN 2150-6086 K1 Couplings K1 Rails K1 Computational modeling K1 Circuit simulation K1 Layout K1 Multichip modules K1 Switches K1 Common mode noise K1 Conducted EMI K1 Capacitive coupling K1 EMI K1 SiC power module SP 255 OP 259 LK http://dx.doi.org/https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213981 DO https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213981 SF ELIB - SuUB Bremen
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