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1
Understanding the Thermal Characteristics of SiC Power MOSF..:
, In:
2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG)
,
Cui, Hongchang
;
Li, Bingyang
;
Kong, Hang
... - p. 1088-1095 , 2023
Link:
https://doi.org/10.1109/PEDG56097.2023.10215269
RT T1 <cTitle>2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG)</cTitle>: T1 <Title>Understanding the Thermal Characteristics of SiC Power MOSFET Device for Power Modules Design</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10215269&Exemplar=1&LAN=DE A1 Cui, Hongchang A1 Li, Bingyang A1 Kong, Hang A1 Yang, Fengtao A1 Wang, Feng A1 Wang, Laili A1 Gao, Kai YR 2023 SN 2329-5767 K1 MOSFET K1 Silicon carbide K1 Thermal resistance K1 Multichip modules K1 Electronic packaging thermal management K1 Thermal analysis K1 Steady-state K1 SiC MOSFET K1 cooling K1 thermal characteristics K1 power modules SP 1088 OP 1095 LK http://dx.doi.org/https://doi.org/10.1109/PEDG56097.2023.10215269 DO https://doi.org/10.1109/PEDG56097.2023.10215269 SF ELIB - SuUB Bremen
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