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EMI Analysis of via stub resonance in a Multi-layer PCB des..:
, In:
2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC)
,
Singamsetty, Siva Krishna
;
Prakash, Namratha
;
V M, Akash
. - p. 1-3 , 2023
Link:
https://doi.org/10.1109/APEMC57782.2023.10217663
RT T1 <cTitle>2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC)</cTitle>: T1 <Title>EMI Analysis of via stub resonance in a Multi-layer PCB design</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10217663&Exemplar=1&LAN=DE A1 Singamsetty, Siva Krishna A1 Prakash, Namratha A1 V M, Akash A1 L, Venkatesha YR 2023 SN 2640-7469 K1 Electromagnetic interference K1 Printed circuits K1 Magnetic resonance K1 Insertion loss K1 Propagation losses K1 Routing K1 Reflector antennas K1 EMI (Electro Magnetic Interference) K1 SRF (Self resonant Frequency) K1 EMC (Electro Magnetic Compatibility) K1 FFS (Far Field Scan) SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/APEMC57782.2023.10217663 DO https://doi.org/10.1109/APEMC57782.2023.10217663 SF ELIB - SuUB Bremen
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