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1 Ergebnisse
1
3D Compact Thermal Model and its Application on Fast Chip L..:
, In:
2023 International Symposium of Electronics Design Automation (ISEDA)
,
Cao, Zhizhu
;
Li, Jiming
;
Tao, Jun
. - p. 246-249 , 2023
Link:
https://doi.org/10.1109/ISEDA59274.2023.10218701
RT T1 <cTitle>2023 International Symposium of Electronics Design Automation (ISEDA)</cTitle>: T1 <Title>3D Compact Thermal Model and its Application on Fast Chip Level Thermal Simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10218701&Exemplar=1&LAN=DE A1 Cao, Zhizhu A1 Li, Jiming A1 Tao, Jun A1 Chen, Yu YR 2023 K1 Solid modeling K1 Visualization K1 Three-dimensional displays K1 Computational modeling K1 Predictive models K1 Electronic packaging thermal management K1 Thermal conductivity K1 chip thermal simulation K1 compact thermal model K1 3D ICs K1 dynamic thermal management K1 model order reduction SP 246 OP 249 LK http://dx.doi.org/https://doi.org/10.1109/ISEDA59274.2023.10218701 DO https://doi.org/10.1109/ISEDA59274.2023.10218701 SF ELIB - SuUB Bremen
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