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1 Ergebnisse
1
The Design-Based Inspection Strategy for CU Void Defects Re..:
, In:
2023 China Semiconductor Technology International Conference (CSTIC)
,
Zhang, Xingdi
;
Chen, Hunglin
;
Long, Yin
. - p. 1-3 , 2023
Link:
https://doi.org/10.1109/CSTIC58779.2023.10219158
RT T1 <cTitle>2023 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>The Design-Based Inspection Strategy for CU Void Defects Reduction</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10219158&Exemplar=1&LAN=DE A1 Zhang, Xingdi A1 Chen, Hunglin A1 Long, Yin A1 Wang, Kai YR 2023 K1 Metals K1 Inspection K1 Reliability K1 Research and development SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC58779.2023.10219158 DO https://doi.org/10.1109/CSTIC58779.2023.10219158 SF ELIB - SuUB Bremen
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