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1 Ergebnisse
1
A Multi-Layer Stacked 3-D SRAM System Based on Wireless Tra..:
, In:
2023 China Semiconductor Technology International Conference (CSTIC)
,
Yang, Kun
;
Sun, Chonghui
;
Tao, Rushuo
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/CSTIC58779.2023.10219165
RT T1 <cTitle>2023 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>A Multi-Layer Stacked 3-D SRAM System Based on Wireless Transceiver using Inductively Coupled Interface in 22-NM CMOS</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10219165&Exemplar=1&LAN=DE A1 Yang, Kun A1 Sun, Chonghui A1 Tao, Rushuo A1 Guo, Jiannan A1 Yang, Cheng A1 Ma, D. A1 Zhu, Xiaolei YR 2023 K1 Wireless communication K1 Power supplies K1 Simulation K1 Bit error rate K1 Stacking K1 Random access memory K1 Multichip modules K1 Inductor K1 wireless communication K1 SRAM K1 3-D package K1 power system stability SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC58779.2023.10219165 DO https://doi.org/10.1109/CSTIC58779.2023.10219165 SF ELIB - SuUB Bremen
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