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Rough Silver for Improved Lead-Frame Reliability:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Ting, Fai-Lung ; So, Ka-Kiu ; Lo, Tsz-Chun.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/CSTIC58779.2023.10219212