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1 Ergebnisse
1
Deep trench (DT) etching process for power MOS device:
, In:
2023 China Semiconductor Technology International Conference (CSTIC)
,
Chen, Chen
;
Xu, Li-Tian
;
Yao, Xing-Jun
- p. 1-2 , 2023
Link:
https://doi.org/10.1109/CSTIC58779.2023.10219225
RT T1
2023 China Semiconductor Technology International Conference (CSTIC)
: T1
Deep trench (DT) etching process for power MOS device
UL https://suche.suub.uni-bremen.de/peid=ieee-10219225&Exemplar=1&LAN=DE A1 Chen, Chen A1 Xu, Li-Tian A1 Yao, Xing-Jun YR 2023 K1 Semiconductor device modeling K1 Fluid flow K1 Silicon K1 Etching K1 Plasmas K1 Temperature control K1 Plasma temperature K1 silicon K1 SF6/O2 K1 bottom rounding K1 undercut K1 inductive coupled plasma K1 NMC612D SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC58779.2023.10219225 DO https://doi.org/10.1109/CSTIC58779.2023.10219225 SF ELIB - SuUB Bremen
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