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1 Ergebnisse
1
Effects of Process to Material Removal in CMP: Modelling an..:
, In:
2023 China Semiconductor Technology International Conference (CSTIC)
,
Ren, Yanming
;
Liu, Yiran
;
Guan, Zijun
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/CSTIC58779.2023.10219260
RT T1 <cTitle>2023 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Effects of Process to Material Removal in CMP: Modelling and Experiments</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10219260&Exemplar=1&LAN=DE A1 Ren, Yanming A1 Liu, Yiran A1 Guan, Zijun A1 Zhu, Lei A1 Gao, Yuanda A1 Yu, Wenjie A1 Li, Weimin YR 2023 K1 Semiconductor device modeling K1 Computational modeling K1 Velocity control K1 Process control K1 Probability K1 Chemicals SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC58779.2023.10219260 DO https://doi.org/10.1109/CSTIC58779.2023.10219260 SF ELIB - SuUB Bremen
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