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1 Ergebnisse
1
Improving 300Mm Si Wafer Planarization Process with a Wholi..:
, In:
2023 China Semiconductor Technology International Conference (CSTIC)
,
Guan, Zijun
;
Liu, Yiran
;
Fan, Jiaming
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/CSTIC58779.2023.10219271
RT T1 <cTitle>2023 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Improving 300Mm Si Wafer Planarization Process with a Wholistic Approach</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10219271&Exemplar=1&LAN=DE A1 Guan, Zijun A1 Liu, Yiran A1 Fan, Jiaming A1 Gao, Yuanda A1 Zhu, Lei A1 Yu, Wenjie A1 Li, Weimin YR 2023 K1 Structural rings K1 Semiconductor device modeling K1 Planarization K1 Focusing K1 Silicon K1 Surface structures K1 Numerical models K1 CMP K1 Wafer flatness K1 Material Removal Rate K1 Slurry K1 Pad K1 Retaining Ring SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC58779.2023.10219271 DO https://doi.org/10.1109/CSTIC58779.2023.10219271 SF ELIB - SuUB Bremen
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