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1 Ergebnisse
1
Electroplating Process Improvement on Post-CMP Dishing Prof..:
, In:
2023 China Semiconductor Technology International Conference (CSTIC)
,
Wu, Wenbo
;
Lei, Tong
;
Zhu, Zhijun
.. - p. 1-3 , 2023
Link:
https://doi.org/10.1109/CSTIC58779.2023.10219308
RT T1 <cTitle>2023 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Electroplating Process Improvement on Post-CMP Dishing Profile</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10219308&Exemplar=1&LAN=DE A1 Wu, Wenbo A1 Lei, Tong A1 Zhu, Zhijun A1 Hu, Zhenhua A1 Chi, Yushan YR 2023 K1 Electrochemical deposition K1 Semiconductor device modeling K1 Optical microscopy K1 Additives K1 Microscopy K1 Optical device fabrication K1 Plating SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC58779.2023.10219308 DO https://doi.org/10.1109/CSTIC58779.2023.10219308 SF ELIB - SuUB Bremen
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