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1 Ergebnisse
1
Effects of different catalysts on epoxy molding compound:
, In:
2023 China Semiconductor Technology International Conference (CSTIC)
,
Duan, Yangyang
;
Tan, Wei
;
Cheng, Xingming
... - p. 1-2 , 2023
Link:
https://doi.org/10.1109/CSTIC58779.2023.10219369
RT T1 <cTitle>2023 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Effects of different catalysts on epoxy molding compound</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10219369&Exemplar=1&LAN=DE A1 Duan, Yangyang A1 Tan, Wei A1 Cheng, Xingming A1 Li, Lanxia A1 Liu, Hongjie A1 Fan, Dandan A1 Liu, Lingling A1 Jiang, Xiaojuan A1 Cui, Liang A1 Cui, Xingzhi YR 2023 K1 Silver K1 Temperature K1 Adhesives K1 Catalysts K1 Epoxy resins K1 Glass K1 Electromagnetic compatibility K1 epoxy molding compound K1 catalyst K1 Tg K1 adhesion SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC58779.2023.10219369 DO https://doi.org/10.1109/CSTIC58779.2023.10219369 SF ELIB - SuUB Bremen
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