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1 Ergebnisse
1
Redistribution Layer aluminum advanced etching process deve..:
, In:
2023 China Semiconductor Technology International Conference (CSTIC)
,
Yao, Xing-Jun
;
Xu, Li-Tian
;
Qi, Li
... - p. 1-2 , 2023
Link:
https://doi.org/10.1109/CSTIC58779.2023.10219379
RT T1 <cTitle>2023 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Redistribution Layer aluminum advanced etching process development</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10219379&Exemplar=1&LAN=DE A1 Yao, Xing-Jun A1 Xu, Li-Tian A1 Qi, Li A1 Sang, Qiang-Qiang A1 Hu, Li-Song A1 Chen-Chen A1 Liu, Yi-Chang YR 2023 K1 Wiring K1 Integrated circuits K1 Mass production K1 Contacts K1 Electronics industry K1 Packaging K1 Etching K1 Advanced Package K1 RDL K1 plasma etch K1 dry etch K1 OX recess K1 double slope SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC58779.2023.10219379 DO https://doi.org/10.1109/CSTIC58779.2023.10219379 SF ELIB - SuUB Bremen
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