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1 Ergebnisse
1
Reliability analysis of metal thermal interface materials f..:
, In:
2023 China Semiconductor Technology International Conference (CSTIC)
,
Ouyang, Keqing
;
Wu, Zhuolun
;
Wang, Zhuqiu
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/CSTIC58779.2023.10219399
RT T1 <cTitle>2023 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Reliability analysis of metal thermal interface materials for ultra-large size FCLGA package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10219399&Exemplar=1&LAN=DE A1 Ouyang, Keqing A1 Wu, Zhuolun A1 Wang, Zhuqiu A1 Wang, Weilun A1 Yang, Dan A1 Mei, Na YR 2023 K1 Thermal analysis K1 Response surface methodology K1 Finite element analysis K1 Indium K1 Plastics K1 Surface cracks K1 Surface treatment SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC58779.2023.10219399 DO https://doi.org/10.1109/CSTIC58779.2023.10219399 SF ELIB - SuUB Bremen
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