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1 Ergebnisse
1
Advanced Manufacturing of Flexible Electronic Circuits by T..:
, In:
2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
,
Happonen, Tuomas
;
Hietala, Mikko
;
Huttunen, Arttu
.. - p. 1-4 , 2023
Link:
https://doi.org/10.1109/FLEPS57599.2023.10220368
RT T1
2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
: T1
Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method
UL https://suche.suub.uni-bremen.de/peid=ieee-10220368&Exemplar=1&LAN=DE A1 Happonen, Tuomas A1 Hietala, Mikko A1 Huttunen, Arttu A1 Kololuoma, Terho A1 Tuomikoski, Markus YR 2023 SN 2832-8256 K1 Temperature sensors K1 Metals K1 Sensor systems K1 Manufacturing K1 Sensors K1 Laminates K1 Flexible electronics K1 adhesive film K1 converting K1 die-cutting K1 flexible circuits K1 metal film K1 roll-to-roll SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/FLEPS57599.2023.10220368 DO https://doi.org/10.1109/FLEPS57599.2023.10220368 SF ELIB - SuUB Bremen
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