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Ultra-Thin Chips for High-Performance Semi-Transparent Flex..:

, In: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS),
Ma, Sihang ; Dahiya, Abhishek Singh ; Karagiorgis, Xenofon. - p. 1-4 , 2023
Link: https://doi.org/10.1109/FLEPS57599.2023.10220424