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1 Ergebnisse
1
A Novel Multiphysics Simulation Method for Packaging Analys..:
, In:
2023 Photonics & Electromagnetics Research Symposium (PIERS)
,
Zhang, Peng Rui
;
Liu, Yi Ming
;
Di Ouyang, Jin
... - p. 1809-1816 , 2023
Link:
https://doi.org/10.1109/PIERS59004.2023.10221351
RT T1 <cTitle>2023 Photonics & Electromagnetics Research Symposium (PIERS)</cTitle>: T1 <Title>A Novel Multiphysics Simulation Method for Packaging Analysis of Chips Based on MOOSE</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10221351&Exemplar=1&LAN=DE A1 Zhang, Peng Rui A1 Liu, Yi Ming A1 Di Ouyang, Jin A1 Chen, Ming Chu A1 Gao, Jun Cheng A1 Du, Yuan Yang A1 Tong, Mei Song YR 2023 SN 2831-5804 K1 Couplings K1 Thermodynamics K1 Interpolation K1 Packaging K1 Finite element analysis K1 Computational efficiency K1 Time-domain analysis SP 1809 OP 1816 LK http://dx.doi.org/https://doi.org/10.1109/PIERS59004.2023.10221351 DO https://doi.org/10.1109/PIERS59004.2023.10221351 SF ELIB - SuUB Bremen
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