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1
Analyzing the Capacitance Coupling of Electrodes with a Sol..:
, In:
2023 IEEE 24th International Conference of Young Professionals in Electron Devices and Materials (EDM)
,
Drozdova, Anastasiya A.
;
Nikolaev, Ilya I.
;
Komnatnov, Maxim E.
- p. 300-303 , 2023
Link:
https://doi.org/10.1109/EDM58354.2023.10225146
RT T1
2023 IEEE 24th International Conference of Young Professionals in Electron Devices and Materials (EDM)
: T1
Analyzing the Capacitance Coupling of Electrodes with a Solder Layer on the Transistor Footprint
UL https://suche.suub.uni-bremen.de/peid=ieee-10225146&Exemplar=1&LAN=DE A1 Drozdova, Anastasiya A. A1 Nikolaev, Ilya I. A1 Komnatnov, Maxim E. YR 2023 SN 2325-419X K1 Electrodes K1 Analytical models K1 Electromagnetic interference K1 Immunity testing K1 Logic gates K1 Capacitance K1 SPICE K1 electromagnetic compatibility K1 footprint K1 capacitance matrix K1 quasi-static model K1 SPICE model SP 300 OP 303 LK http://dx.doi.org/https://doi.org/10.1109/EDM58354.2023.10225146 DO https://doi.org/10.1109/EDM58354.2023.10225146 SF ELIB - SuUB Bremen
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