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1 Ergebnisse
1
Multi-Mode AI Accelerator Architecture for Thermal-Aware 3D..:
, In:
2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan)
,
Varma M, Hari Chandhana
;
Swaminathan, Advaidh
;
Lin, Shu-Yen
- p. 637-638 , 2023
Link:
https://doi.org/10.1109/ICCE-Taiwan58799.2023.10227033
RT T1
2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan)
: T1
Multi-Mode AI Accelerator Architecture for Thermal-Aware 3D Stacked Deep Neural Network Design
UL https://suche.suub.uni-bremen.de/peid=ieee-10227033&Exemplar=1&LAN=DE A1 Varma M, Hari Chandhana A1 Swaminathan, Advaidh A1 Lin, Shu-Yen YR 2023 SN 2575-8284 K1 Solid modeling K1 Three-dimensional displays K1 Power demand K1 Computational modeling K1 AI accelerators K1 Artificial neural networks K1 Computer architecture K1 AI Accelerator K1 Bit Fusion K1 deep neural networks SP 637 OP 638 LK http://dx.doi.org/https://doi.org/10.1109/ICCE-Taiwan58799.2023.10227033 DO https://doi.org/10.1109/ICCE-Taiwan58799.2023.10227033 SF ELIB - SuUB Bremen
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