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1 Ergebnisse
1
Hardware Design and Development of Modular Multilevel Conve..:
, In:
2023 IEEE 17th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)
,
Mayank, Kumar
;
Verma, Atul
;
Meikap, Somnath
.. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/CPE-POWERENG58103.2023.1022746
RT T1 <cTitle>2023 IEEE 17th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)</cTitle>: T1 <Title>Hardware Design and Development of Modular Multilevel Converter</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10227465&Exemplar=1&LAN=DE A1 Mayank, Kumar A1 Verma, Atul A1 Meikap, Somnath A1 Hrishikesan, V M A1 Kumar, Chandan YR 2023 SN 2166-9546 K1 Resistance K1 Multilevel converters K1 Power engineering K1 Low voltage K1 Scalability K1 Prototypes K1 Gate drivers K1 Modular multi-level converter (MMC) K1 submodule K1 grid forming inverter SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/CPE-POWERENG58103.2023.10227465 DO https://doi.org/10.1109/CPE-POWERENG58103.2023.10227465 SF ELIB - SuUB Bremen
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