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1 Ergebnisse
1
Comprehensive Optimization of Differential Via Design for H..:
, In:
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
,
Huang, Nick K. H.
;
Lai, Jim
- p. 361-364 , 2023
Link:
https://doi.org/10.1109/EMCSIPI50001.2023.10241442
RT T1 <cTitle>2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)</cTitle>: T1 <Title>Comprehensive Optimization of Differential Via Design for High-Speed Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10241442&Exemplar=1&LAN=DE A1 Huang, Nick K. H. A1 Lai, Jim YR 2023 K1 Inductance K1 Statistical analysis K1 Printed circuits K1 Data visualization K1 Insertion loss K1 Capacitance K1 Impedance K1 signal integrity K1 via design K1 via impedance K1 insertion loss K1 anti-pad K1 optimization SP 361 OP 364 LK http://dx.doi.org/https://doi.org/10.1109/EMCSIPI50001.2023.10241442 DO https://doi.org/10.1109/EMCSIPI50001.2023.10241442 SF ELIB - SuUB Bremen
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