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1 Ergebnisse
1
Signal Integrity Analysis of Wire Bonding Finger Capacitanc..:
, In:
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
,
Kim, Hyunwoong
;
Park, Gagyeong
;
Ryu, Seunghun
... - p. 141-146 , 2023
Link:
https://doi.org/10.1109/EMCSIPI50001.2023.10241728
RT T1 <cTitle>2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)</cTitle>: T1 <Title>Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10241728&Exemplar=1&LAN=DE A1 Kim, Hyunwoong A1 Park, Gagyeong A1 Ryu, Seunghun A1 Kim, Jongwook A1 Lee, Jaehoon A1 Ahn, Seungyoung YR 2023 K1 Loading K1 Wires K1 Fingers K1 Capacitance K1 Reflection K1 Topology K1 Scattering parameters K1 Low-power double data rate (LPDDR) K1 multi-drop K1 package K1 reflection K1 wire bonding SP 141 OP 146 LK http://dx.doi.org/https://doi.org/10.1109/EMCSIPI50001.2023.10241728 DO https://doi.org/10.1109/EMCSIPI50001.2023.10241728 SF ELIB - SuUB Bremen
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