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1 Ergebnisse
1
Static I-V based PIM Evaluation for Spring and Fabric-over-..:
, In:
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
,
Anjajo, Kalkidan W.
;
Xu, Yang
;
Xia, Shengxuan
... - p. 83-87 , 2023
Link:
https://doi.org/10.1109/EMCSIPI50001.2023.10241745
RT T1 <cTitle>2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)</cTitle>: T1 <Title>Static I-V based PIM Evaluation for Spring and Fabric-over-Foam Contacts</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10241745&Exemplar=1&LAN=DE A1 Anjajo, Kalkidan W. A1 Xu, Yang A1 Xia, Shengxuan A1 He, Yuchu A1 Zhou, Haicheng A1 Wang, Hanfeng A1 Park, Jonghyun A1 Hwang, Chulsoon YR 2023 K1 Performance evaluation K1 Sensitivity K1 Shape K1 Estimation K1 Receivers K1 Production facilities K1 Mobile handsets K1 passive intermodulation (PIM) K1 radio frequency interference (RFI) K1 fabric-over-foam K1 spring contacts K1 1-V curve SP 83 OP 87 LK http://dx.doi.org/https://doi.org/10.1109/EMCSIPI50001.2023.10241745 DO https://doi.org/10.1109/EMCSIPI50001.2023.10241745 SF ELIB - SuUB Bremen
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