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Muffin: A Framework Toward Multi-Dimension AI Fairness by U..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),
Sheng, Yi ; Yang, Junhuan ; Yang, Lei... - p. 1-6 , 2023
Link: https://doi.org/10.1109/DAC56929.2023.10247765