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1 Ergebnisse
1
Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits:
, In:
2023 60th ACM/IEEE Design Automation Conference (DAC)
,
Rich, Dennis
;
Kasperovich, Anna
;
Malakoutian, Mohamadali
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/DAC56929.2023.10247815
RT T1
2023 60th ACM/IEEE Design Automation Conference (DAC)
: T1
Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits
UL https://suche.suub.uni-bremen.de/peid=ieee-10247815&Exemplar=1&LAN=DE A1 Rich, Dennis A1 Kasperovich, Anna A1 Malakoutian, Mohamadali A1 Radway, Robert M. A1 Hagiwara, Shiho A1 Yoshikawa, Takahide A1 Chowdhury, Srabanti A1 Mitra, Subhasish YR 2023 K1 Heating systems K1 Three-dimensional displays K1 Processor scheduling K1 Metals K1 Conductivity K1 Thermal conductivity K1 Thermal management K1 thermal management K1 3D integrated circuits K1 back-end-of-line thermal conductivity SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/DAC56929.2023.10247815 DO https://doi.org/10.1109/DAC56929.2023.10247815 SF ELIB - SuUB Bremen
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