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State-Of-The-Art Approach to Mitigate Risk of Die Crack wit..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Ying, Cham Hooi ; Jen Wai, Ooi ; Yik, Tan Thian.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/IPFA58228.2023.10248984