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1 Ergebnisse
1
Measurement of Aluminium Remnant Thickness on Copper Wire B..:
, In:
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Supramaniam, Saraswathy
;
Periasamy, Subashini
;
Nurhisham, Muhammad
.. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/IPFA58228.2023.10249045
RT T1 <cTitle>2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)</cTitle>: T1 <Title>Measurement of Aluminium Remnant Thickness on Copper Wire Bonding using 3D Laser Scanning Microscope</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10249045&Exemplar=1&LAN=DE A1 Supramaniam, Saraswathy A1 Periasamy, Subashini A1 Nurhisham, Muhammad A1 Bakar, Maria Abu A1 Jalar, Azman YR 2023 SN 1946-1550 K1 Laser theory K1 Three-dimensional displays K1 Microscopy K1 Aluminum K1 Area measurement K1 Semiconductor device reliability K1 Measurement by laser beam K1 Aluminum remnant thickness K1 3D Laser Scanning Microscope K1 Centralized and average measurement method & Turn-Around Time(TAT) SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IPFA58228.2023.10249045 DO https://doi.org/10.1109/IPFA58228.2023.10249045 SF ELIB - SuUB Bremen
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