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Thermal simulations of lock-in-thermography for failure ana..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Qiu, Wen ; Zee, Bernice ; Pey, Kin Leong. - p. 1-6 , 2023
Link: https://doi.org/10.1109/IPFA58228.2023.10249046