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1 Ergebnisse
1
Tombstoning Investigation of Ultra-small Chip Passive Compo..:
, In:
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Hsu, Yun-Ting
;
Zou, Yung-Sheng
;
Chung, Min-Hua
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/IPFA58228.2023.10249092
RT T1 <cTitle>2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)</cTitle>: T1 <Title>Tombstoning Investigation of Ultra-small Chip Passive Components on eMMC Products</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10249092&Exemplar=1&LAN=DE A1 Hsu, Yun-Ting A1 Zou, Yung-Sheng A1 Chung, Min-Hua A1 Gan, Chong-Leong A1 Venkatraman, Venkatesh A1 Paul, Anila A1 Low, Winnie A1 Che, Faxing YR 2023 SN 1946-1550 K1 Integrated circuits K1 Heating systems K1 Multimedia systems K1 Failure analysis K1 Packaging K1 Ceramic capacitors K1 Thermal conductivity K1 Tombstone K1 passive component K1 surface mount K1 ultra-small chip component K1 eMMC K1 reflow profile K1 terminal length K1 package design SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/IPFA58228.2023.10249092 DO https://doi.org/10.1109/IPFA58228.2023.10249092 SF ELIB - SuUB Bremen
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