I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Study of moisture penetration in chip passivation layer by ..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/IPFA58228.2023.10249096