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Test And Reliability Improvement With Defect-Image Classifi..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),

Berges, Corinne ; Zhang, Shilu ; Leteve, Audrey... - p. 1-9 , 2023

Link: https://doi.org/10.1109/IPFA58228.2023.10249118

RT 
T1 <cTitle>2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)</cTitle>: T1 <Title>Test And Reliability Improvement With Defect-Image Classification And Machine-Learning Algorithms In Semiconductor Industry For Automotive Applications</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10249118&Exemplar=1&LAN=DE
				
A1 Berges, Corinne
A1 Zhang, Shilu
A1 Leteve, Audrey
A1 Anilturk, Onder
A1 Bird, Jim
A1 Lumanauw, Edwin
A1 Shroff, Mehul D.
A1 Hakem Zulkifli, Azizul
A1 Foo, Loke Sheng
A1 Choo, Shengzi
A1 Smith, Chris
YR 2023
SN 1946-1550
K1 Semiconductor device modeling
K1 Analytical models
K1 Costs
K1 Semiconductor device reliability
K1 Automotive applications
K1 Manuals
K1 Machine learning
K1 Automotive-semiconductor manufacturing
K1 automated optical inspection
K1 defectivity
K1 failure prevention
K1 data analytics
K1 machine-learning
K1 big data
SP 1
OP 9
LK http://dx.doi.org/https://doi.org/10.1109/IPFA58228.2023.10249118
DO https://doi.org/10.1109/IPFA58228.2023.10249118
SF ELIB - SuUB Bremen

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