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1 Ergebnisse
1
Robust Image Processing Software for Void Calculation in Th..:
, In:
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Song, Mei-Hui
;
Oh, Zi-Ying
;
Lee, Xi-Wen
... - p. 1-8 , 2023
Link:
https://doi.org/10.1109/IPFA58228.2023.10249157
RT T1
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
: T1
Robust Image Processing Software for Void Calculation in Thermal Interface Materials
UL https://suche.suub.uni-bremen.de/peid=ieee-10249157&Exemplar=1&LAN=DE A1 Song, Mei-Hui A1 Oh, Zi-Ying A1 Lee, Xi-Wen A1 Ng, Marcus A1 Zee, Bernice A1 Foo, Fang-Jie A1 Jiang, Ting-Ying YR 2023 SN 1946-1550 K1 Radiography K1 Smoothing methods K1 Microprocessors K1 Manuals K1 Inspection K1 Thermal conductivity K1 Software K1 TIM Voids K1 Image Processing K1 Voids Detection SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/IPFA58228.2023.10249157 DO https://doi.org/10.1109/IPFA58228.2023.10249157 SF ELIB - SuUB Bremen
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