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Creep Viscoplastic Characterization of SAC Solders Exposed ..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Liu, Vance ; Lin, Sih-Tung ; Chang, Esan.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/IPFA58228.2023.10249165