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1 Ergebnisse
1
Oxygen-Based Microwave Induced Plasma Etching for Epoxy Mol..:
, In:
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Tan, Hong Siang
;
Zee, Bernice
;
Gan, Chee Lip
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/IPFA58228.2023.10249167
RT T1 <cTitle>2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)</cTitle>: T1 <Title>Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10249167&Exemplar=1&LAN=DE A1 Tan, Hong Siang A1 Zee, Bernice A1 Gan, Chee Lip A1 Kor, Katherine A1 Tang, Jiaqi A1 McKinnon, Mark YR 2023 SN 1946-1550 K1 Microwave integrated circuits K1 Semiconductor devices K1 Failure analysis K1 Microwave devices K1 Electromagnetic compatibility K1 Microwave theory and techniques K1 Microwave circuits K1 Epoxy Molding Compounds K1 Microwave Induced Plasma (MIP) SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IPFA58228.2023.10249167 DO https://doi.org/10.1109/IPFA58228.2023.10249167 SF ELIB - SuUB Bremen
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