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Reliability study of the three-dimensional porous flexible ..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Shen, Junhao ; Sun, Yuhan ; Gong, Danni... - p. 1-4 , 2023
Link: https://doi.org/10.1109/IPFA58228.2023.10249188