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1 Ergebnisse
1
Pin Assignment Optimization of BGA Packages for EMI Mitigat..:
, In:
2023 International Applied Computational Electromagnetics Society Symposium (ACES-China)
,
Li, Bing-Heng
;
Li, Da
;
Zhang, Ling
... - p. 1-3 , 2023
Link:
https://doi.org/10.23919/ACES-China60289.2023.10249414
RT T1 <cTitle>2023 International Applied Computational Electromagnetics Society Symposium (ACES-China)</cTitle>: T1 <Title>Pin Assignment Optimization of BGA Packages for EMI Mitigation Using Deep Reinforcement Learning</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10249414&Exemplar=1&LAN=DE A1 Li, Bing-Heng A1 Li, Da A1 Zhang, Ling A1 Gu, Zhe-Ming A1 Huang, Shao-Ying A1 Li, Er-Ping YR 2023 K1 Deep learning K1 Training K1 Electromagnetic interference K1 Reinforcement learning K1 Packaging K1 Electromagnetic compatibility K1 Encoding K1 Pin assignment K1 ball grid array packages K1 electromagnetic interference mitigation K1 deep reinforcement learning SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.23919/ACES-China60289.2023.10249414 DO https://doi.org/10.23919/ACES-China60289.2023.10249414 SF ELIB - SuUB Bremen
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