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1 Ergebnisse
1
An VIE-PEEC Method for Circuit Parameters Extraction from C..:
, In:
2023 International Applied Computational Electromagnetics Society Symposium (ACES-China)
,
Tang, Yu
;
Cai, Qiang-Ming
;
Zhou, Ce-Ming
... - p. 1-2 , 2023
Link:
https://doi.org/10.23919/ACES-China60289.2023.10250082
RT T1 <cTitle>2023 International Applied Computational Electromagnetics Society Symposium (ACES-China)</cTitle>: T1 <Title>An VIE-PEEC Method for Circuit Parameters Extraction from Complex Packaging Structures</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10250082&Exemplar=1&LAN=DE A1 Tang, Yu A1 Cai, Qiang-Ming A1 Zhou, Ce-Ming A1 Guo, Feng A1 Cao, Xin A1 Zhou, Longjian A1 Zhu, Yuyu A1 Fan, Jun YR 2023 K1 Resistance K1 Inductance K1 Integral equations K1 RLC circuits K1 Packaging K1 Electromagnetics K1 Integrated circuit modeling K1 partial element equivalent circuit (PEEC) method K1 electric field integral equation (EFIE) K1 SWG basis function K1 conductor - dielectric composite AC circuits SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/ACES-China60289.2023.10250082 DO https://doi.org/10.23919/ACES-China60289.2023.10250082 SF ELIB - SuUB Bremen
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