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1
Study on Forming and Properties of Heat Resistant Low Expan..:
, In:
2023 International Conference on Mechatronics, IoT and Industrial Informatics (ICMIII)
,
Li, Zhiyong
;
Jalar, Azman
- p. 292-296 , 2023
Link:
https://doi.org/10.1109/ICMIII58949.2023.00061
RT T1 <cTitle>2023 International Conference on Mechatronics, IoT and Industrial Informatics (ICMIII)</cTitle>: T1 <Title>Study on Forming and Properties of Heat Resistant Low Expansion High Silicon Aluminum Alloy Based on Genetic Algorithm</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10256709&Exemplar=1&LAN=DE A1 Li, Zhiyong A1 Jalar, Azman YR 2023 K1 Thermal expansion K1 Temperature K1 Metals K1 Conductivity K1 Aluminum alloys K1 Thermal conductivity K1 Silicon K1 Genetic algorithm K1 High silicon aluminum alloy K1 Die casting K1 heat expansion SP 292 OP 296 LK http://dx.doi.org/https://doi.org/10.1109/ICMIII58949.2023.00061 DO https://doi.org/10.1109/ICMIII58949.2023.00061 SF ELIB - SuUB Bremen
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