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1 Ergebnisse
1
Thin-Film Memristors and Memcapacitors for 3D Integration o..:
, In:
2023 IEEE 36th International System-on-Chip Conference (SOCC)
,
Kimura, Mutsumi
;
Shiomi, Shu
;
Komai, Norito
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/SOCC58585.2023.10257032
RT T1 <cTitle>2023 IEEE 36th International System-on-Chip Conference (SOCC)</cTitle>: T1 <Title>Thin-Film Memristors and Memcapacitors for 3D Integration of Neuromorphic Systems</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10257032&Exemplar=1&LAN=DE A1 Kimura, Mutsumi A1 Shiomi, Shu A1 Komai, Norito A1 Iwagi, Etsuko A1 Yokoyama, Tomoharu A1 Ishisaki, Yuma A1 Matsuda, Tokiyoshi A1 Kawanishi, Hidenori YR 2023 SN 2164-1706 K1 Associative memory K1 Neuromorphics K1 Nonvolatile memory K1 Capacitance-voltage characteristics K1 Memristors K1 Large scale integration K1 Low-power electronics K1 thin film K1 memristor K1 memcapacitor K1 3D integration K1 neuromorphic system SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/SOCC58585.2023.10257032 DO https://doi.org/10.1109/SOCC58585.2023.10257032 SF ELIB - SuUB Bremen
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