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1 Ergebnisse
1
2D Simulation Analysis of Power Electronics Packaging Struc..:
, In:
2023 3rd International Conference on Energy Engineering and Power Systems (EEPS)
,
Sun, Ya
;
Luo, Bing
;
Hu, Jun
... - p. 587-592 , 2023
Link:
https://doi.org/10.1109/EEPS58791.2023.10257065
RT T1 <cTitle>2023 3rd International Conference on Energy Engineering and Power Systems (EEPS)</cTitle>: T1 <Title>2D Simulation Analysis of Power Electronics Packaging Structure Utilizing ZnO-Microvaristor based Adaptive Composites</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10257065&Exemplar=1&LAN=DE A1 Sun, Ya A1 Luo, Bing A1 Hu, Jun A1 Xu, Yongsheng A1 Huang, Zhiwen A1 Xu, Gangyi A1 Zhang, Bo A1 He, Jinliang YR 2023 K1 Insulated gate bipolar transistors K1 II-VI semiconductor materials K1 Shape K1 Welding K1 Zinc oxide K1 Power electronics K1 Ceramics K1 power electronics packaging K1 partial discharge K1 ZnO composites K1 electric field grading SP 587 OP 592 LK http://dx.doi.org/https://doi.org/10.1109/EEPS58791.2023.10257065 DO https://doi.org/10.1109/EEPS58791.2023.10257065 SF ELIB - SuUB Bremen
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