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1
Thermal cycling characterization of integrated GaN power mo..:
, In:
2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)
,
Sun, Zhongchao
;
Takahashi, Masaki
;
Munk-Nielsen, Stig
. - p. 1-7 , 2023
Link:
https://doi.org/10.23919/EPE23ECCEEurope58414.2023.102..
RT T1 <cTitle>2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)</cTitle>: T1 <Title>Thermal cycling characterization of integrated GaN power module</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10264265&Exemplar=1&LAN=DE A1 Sun, Zhongchao A1 Takahashi, Masaki A1 Munk-Nielsen, Stig A1 Jorgensen, Asger Bjorn YR 2023 K1 Degradation K1 Temperature measurement K1 Thermal resistance K1 Multichip modules K1 Failure analysis K1 Europe K1 Electronic packaging thermal management K1 Failure modes K1 Gallium Nitride (GaN) K1 Packaging K1 Thermal cycling SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264265 DO https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264265 SF ELIB - SuUB Bremen
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