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1 Ergebnisse
1
Metal Gel Material: A Novel Liquid Metal Paste for Thermal ..:
, In:
2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
,
Neumann, Taylor V.
;
Spielman, Vaughn
;
Hopkins, Michael A.
.. - p. 1-4 , 2023
Link:
https://doi.org/10.23919/SEMI-THERM59981.2023.10267879
RT T1 <cTitle>2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)</cTitle>: T1 <Title>Metal Gel Material: A Novel Liquid Metal Paste for Thermal Management Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10267879&Exemplar=1&LAN=DE A1 Neumann, Taylor V. A1 Spielman, Vaughn A1 Hopkins, Michael A. A1 Wallans, Michael A1 Ronay, Mark YR 2023 SN 2577-1000 K1 Solvents K1 Liquids K1 Metals K1 Conductivity K1 Thermal conductivity K1 Thermal management K1 Thermal loading K1 Thermal interface material K1 contact area K1 bond line thickness K1 conformability K1 compressibility SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.23919/SEMI-THERM59981.2023.10267879 DO https://doi.org/10.23919/SEMI-THERM59981.2023.10267879 SF ELIB - SuUB Bremen
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