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1 Ergebnisse
1
Flow Boiling Heat Transfer Performance Comparison of Skived..:
, In:
2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
,
Lin, Fang-Chou
;
Liu, Chien-Fu
;
Yang, Ming-Tsung
... - p. 1-5 , 2023
Link:
https://doi.org/10.23919/SEMI-THERM59981.2023.10267893
RT T1 <cTitle>2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)</cTitle>: T1 <Title>Flow Boiling Heat Transfer Performance Comparison of Skived Straight and CNC Diverging Microchannels Heat Sinks</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10267893&Exemplar=1&LAN=DE A1 Lin, Fang-Chou A1 Liu, Chien-Fu A1 Yang, Ming-Tsung A1 Lee, Sung-Wei A1 Hsu, Cheng-Hung A1 Sung, Kuan-Fu A1 Yang, Chien-Yuh YR 2023 SN 2577-1000 K1 Thermal resistance K1 Heat sinks K1 Heat transfer K1 Commercialization K1 Microchannels K1 Resistance heating SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/SEMI-THERM59981.2023.10267893 DO https://doi.org/10.23919/SEMI-THERM59981.2023.10267893 SF ELIB - SuUB Bremen
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