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1 Ergebnisse
1
Electronics design of piezo-resistive MEMS microphone array..:
, In:
2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)
,
Garcia-Souto, Jose A.
;
Baez-Rivera, Cindy A.
;
Erbacher, Kolja
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/DTIP58682.2023.10267950
RT T1 <cTitle>2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)</cTitle>: T1 <Title>Electronics design of piezo-resistive MEMS microphone arrays for aero-acoustics in flight tests</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10267950&Exemplar=1&LAN=DE A1 Garcia-Souto, Jose A. A1 Baez-Rivera, Cindy A. A1 Erbacher, Kolja A1 Carrillo-Agudo, Pablo A1 Ngo, Ha Duong A1 Acedo, Pablo YR 2023 SN 2768-1874 K1 Micromechanical devices K1 Integrated circuits K1 Temperature sensors K1 Temperature distribution K1 Filtering K1 Instruments K1 Packaging K1 piezoresistive MEMS microphone K1 aero-acoustic measurement K1 microphone array K1 flight tests K1 front-end SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/DTIP58682.2023.10267950 DO https://doi.org/10.1109/DTIP58682.2023.10267950 SF ELIB - SuUB Bremen
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