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1 Ergebnisse
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ESD mitigation for 3D IC hybrid bonding:
, In:
2023 45th Annual EOS/ESD Symposium (EOS/ESD)
,
Lin, Shih-Hsiang
;
Simicic, Marko
;
Pantano, Nicolas
... - p. 1-9 , 2023
Link:
https://doi.org/10.23919/EOS/ESD58195.2023.10287746
RT T1
2023 45th Annual EOS/ESD Symposium (EOS/ESD)
: T1
ESD mitigation for 3D IC hybrid bonding
UL https://suche.suub.uni-bremen.de/peid=ieee-10287746&Exemplar=1&LAN=DE A1 Lin, Shih-Hsiang A1 Simicic, Marko A1 Pantano, Nicolas A1 Chen, Shih-Hung A1 Roussel, Philippe A1 Van Der Plas, Geert A1 Beyne, Eric A1 Wambacq, Piet YR 2023 K1 Integrated circuits K1 Three-dimensional displays K1 Stacking K1 Ionization K1 Voltage K1 Arc discharges K1 Electrostatic discharges SP 1 OP 9 LK http://dx.doi.org/https://doi.org/10.23919/EOS/ESD58195.2023.10287746 DO https://doi.org/10.23919/EOS/ESD58195.2023.10287746 SF ELIB - SuUB Bremen
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