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1 Ergebnisse
1
Comparative life cycle assessment of hybrid bonding and cop..:
, In:
2023 18th European Microwave Integrated Circuits Conference (EuMIC)
,
Roulleau, Lea
;
Vauche, Laura
;
Valorge, Olivier
.. - p. 390-393 , 2023
Link:
https://doi.org/10.23919/EuMIC58042.2023.10288972
RT T1 <cTitle>2023 18th European Microwave Integrated Circuits Conference (EuMIC)</cTitle>: T1 <Title>Comparative life cycle assessment of hybrid bonding and copper pillar die-to-wafer 3D integrations for sub-THz applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10288972&Exemplar=1&LAN=DE A1 Roulleau, Lea A1 Vauche, Laura A1 Valorge, Olivier A1 Dubarry, Christophe A1 Cioccio, Lea Di YR 2023 K1 Three-dimensional displays K1 Integrated circuit interconnections K1 Throughput K1 Silicon K1 Recycling K1 Copper K1 Bonding K1 Climate change K1 Life cycle assessment K1 Global warming K1 Government policies K1 3D interconnection K1 Life Cycle Assessment K1 Life Cycle Inventory K1 hybrid bonding K1 copper pillar K1 6G SP 390 OP 393 LK http://dx.doi.org/https://doi.org/10.23919/EuMIC58042.2023.10288972 DO https://doi.org/10.23919/EuMIC58042.2023.10288972 SF ELIB - SuUB Bremen
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