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1 Ergebnisse
1
Characteristic Parameters Analysis of Bond-Wire Failure for..:
, In:
2023 IEEE/IAS Industrial and Commercial Power System Asia (I&CPS Asia)
,
Min, Yuan
;
Xing, Zhen
;
Ding, Xueni
... - p. 516-520 , 2023
Link:
https://doi.org/10.1109/ICPSAsia58343.2023.10294789
RT T1
2023 IEEE/IAS Industrial and Commercial Power System Asia (I&CPS Asia)
: T1
Characteristic Parameters Analysis of Bond-Wire Failure for Multi-Chips Parallel IGBT Modules
UL https://suche.suub.uni-bremen.de/peid=ieee-10294789&Exemplar=1&LAN=DE A1 Min, Yuan A1 Xing, Zhen A1 Ding, Xueni A1 Li, Hui A1 Yao, Ran A1 Lai, Wei A1 Yang, Cheng A1 Han, Wenxing A1 Yuan, Yannan YR 2023 K1 Insulated gate bipolar transistors K1 Temperature sensors K1 Magnetic flux density K1 Sensitivity K1 Wires K1 Multichip modules K1 Aging K1 multi-chips parallel IGBT module K1 bond wire lift-off K1 magnetic flux density SP 516 OP 520 LK http://dx.doi.org/https://doi.org/10.1109/ICPSAsia58343.2023.10294789 DO https://doi.org/10.1109/ICPSAsia58343.2023.10294789 SF ELIB - SuUB Bremen
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