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1 Ergebnisse
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The chemical bond structure investigation on the Si-O-C com..:
, In:
IEEE Conference Record - Abstracts. 2002 IEEE International Conference on Plasma Science (Cat. No.02CH37340)
,
Chang Shil Yang
;
Kyoung Suk
;
Chi Kyu Choi
- p. 264 , 2002
Link:
https://doi.org/10.1109/PLASMA.2002.1030549
RT T1
IEEE Conference Record - Abstracts. 2002 IEEE International Conference on Plasma Science (Cat. No.02CH37340)
: T1
The chemical bond structure investigation on the Si-O-C composite films with low dielectric constant deposited by high density plasma chemical vapor deposition
UL https://suche.suub.uni-bremen.de/peid=ieee-1030549&Exemplar=1&LAN=DE A1 Chang Shil Yang A1 Kyoung Suk A1 Chi Kyu Choi YR 2002 K1 Chemical vapor deposition K1 Bonding K1 Dielectric constant K1 Plasma chemistry K1 Plasma density K1 Plasma temperature K1 Fluid flow K1 Annealing K1 Dielectric substrates K1 Gases SP 264 LK http://dx.doi.org/https://doi.org/10.1109/PLASMA.2002.1030549 DO https://doi.org/10.1109/PLASMA.2002.1030549 SF ELIB - SuUB Bremen
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