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1 Ergebnisse
1
Driver-Integrated Silicon Carbide Based Power Module with S..:
, In:
IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society
,
Cheung, Chun-Kit
;
Gao, Ziyang
- p. 1-6 , 2023
Link:
https://doi.org/10.1109/IECON51785.2023.10312695
RT T1
IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society
: T1
Driver-Integrated Silicon Carbide Based Power Module with Self-Optimized Current-Sensorless Temperature-Driven Deadtime Control
UL https://suche.suub.uni-bremen.de/peid=ieee-10312695&Exemplar=1&LAN=DE A1 Cheung, Chun-Kit A1 Gao, Ziyang YR 2023 SN 2577-1647 K1 Temperature measurement K1 MOSFET K1 Thermal factors K1 Silicon carbide K1 Thermal resistance K1 Multichip modules K1 Logic gates K1 silicon carbide K1 driver-integrated K1 half-bridge power module K1 parasitic inductance K1 stray inductance K1 temperature-driven deadtime control K1 current-sensorless SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IECON51785.2023.10312695 DO https://doi.org/10.1109/IECON51785.2023.10312695 SF ELIB - SuUB Bremen
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