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D-Band Flip-Chip Packaging with Wafer-Level Cu-pillar Bumps:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Cao, Zhibo ; Stocchi, Matteo ; Wipf, Christian... - p. 1-4 , 2023
Link: https://doi.org/10.1109/EPEPS58208.2023.10314877